Overview

Ferri-UFS™ is a highly integrated solution which combines a feature-wise flash controller compliant with the latest UFS2.1 standard and standard NAND flash memory. Its high-performance storage accessing, better power efficiency, and ease of system design make the Ferri-UFS™ a fabulous solution for automotive, industrial, embedded, and portable applications. For automotive IVI applications, Ferri-UFS™ features industry-leading low dppm, AEC-Q100 grade 3/2 qualification, and product longevity support.

The Ferri-UFS™ leverages industry-leading technology and experience in NAND management, and supports the UFS2.1 advanced features such as HS-Gear3 x 2-lane mode and command queue. With extended temperature and various capacity support, offering easy and rapid design integration, the Ferri-UFS™ also ideally fits the requirements of point-of-sale terminals, networking and telecommunications equipment, and a variety of leading-edge industrial applications. With superior performance, multitasking support, and high stability, the Ferri-UFS™ can seamlessly serve the needs of a wide variety of mobile devices and new booming embedded/portable applications.

Embedded applications using eMMC today can migrate to Ferri-UFS™ for higher performance and capacity options. Additionally, Ferri-UFS™ can be customized via firmware for specific features and applications.

As the world's leading NAND controller vendor, Silicon Motion builds its products to the highest quality and reliability standards – backed by outstanding sales and technical support from design through post-production. Silicon Motion's commitment to automotive and industrial quality is fully incorporated throughout the design, manufacturing, and qualification phases of its Ferri-UFS™ products.

Features

High-Efficiency Error Correction

  • Advanced Hardware LDPC (ECC) Engine
  • StaticDataRefresh™ and EarlyRetirement™ technologies ensure the data reliability

Power Efficiency

  • Dynamic power management technology enables multiple power-saving modes

Advanced Global Wear Leveling to Enhance Reliability

  • Even distribution of program / erase cycles across all NAND flash chips
  • Maximizes the lifespan with low Write Amplification Index (WAI)

Robust Data Protection

  • Advanced system-level protection against unstable power
  • Software / hardware write protect option
  • Multiple user data security zones
  • Software / hardware secure erase function
  • PowerShield and DataPhoenix technologies prevent data corruption in case of sudden power lost

Automotive IVI compliance to the AEC-Q100 grade 3/2 requirements

Selection Guide

File Product Interface Flash Type Capacity Temp. Range Size(mm)
SM671 UFS2.1 Gen3x2 3D SLC mode /
3D TLC mode
5-256GB •c-temp: -25℃ to 85℃
•i-temp: -40℃ to 85℃
•Automotive grade3: -40℃ to +85℃
•Automotive grade2: -40℃ to +105℃
11.5x13
MCM BGA